Suwon, South Korea

Ha Y Kim

This inventor holds 1 USPTO granted patent. Top assignee: S K M Ltd.. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ha Y Kim. Retrieved from https://idiyas.com/inventor/ha-y-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: Ha Y Kim - Innovator in Packaging Solutions

Introduction

Ha Y Kim is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique carrying package designed specifically for pancake reels.

Latest Patents

Ha Y Kim holds a patent for a "Carrying package of pancake reels and method of recovering the package." This invention provides a comprehensive solution for packaging pancake reels made by winding magnetic tapes on hubs. The carrying package consists of a pallet, a body, a lower cap, an upper cap, and bonding bands. The design features four interconnected walls that house packing units, two lattices, and an intermediate plate. This structure allows for efficient storage and recovery of the packaging after use.

Career Highlights

Ha Y Kim is associated with S K M Ltd., where he applies his expertise in packaging solutions. His work focuses on enhancing the efficiency and functionality of packaging systems. His innovative designs have the potential to streamline operations in various industries.

Collaborations

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Conclusion

Ha Y Kim's contributions to packaging technology exemplify the importance of innovation in improving product handling and recovery processes. His patent reflects a commitment to creating practical solutions that benefit both manufacturers and consumers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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