Gyeongho Kim

Title: Gyeongho Kim - Innovator in Semiconductor Packaging

Introduction

Gyeongho Kim is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and technologies. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Gyeongho Kim holds a patent for a fan-out semiconductor package. This innovative package includes a wiring substrate that features a first fan-in region, a fan-out region surrounding the first fan-in region, and a second fan-in region. The design incorporates a first fan-in chip structure and a second fan-in chip structure. Additionally, it includes a first redistribution structure with first redistribution elements on the bottom surface of the wiring substrate, and a second redistribution structure on the top surface. The second redistribution structure is designed with a second redistribution layer that extends to both the first fan-in region and the fan-out region, along with a plurality of second redistribution vias and a seed layer surrounding the second redistribution layer.

Career Highlights

Gyeongho Kim is currently employed at Samsung Electronics Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge semiconductor technologies, contributing to the company's reputation for innovation and quality in electronic products.

Collaborations

Gyeongho Kim collaborates with fellow inventor Byungho Kim, enhancing the development of semiconductor technologies through their combined expertise and innovative approaches.

Conclusion

Gyeongho Kim's contributions to semiconductor packaging exemplify his commitment to innovation in technology. His patent and work at Samsung Electronics Ltd. highlight his role as a key player in advancing semiconductor solutions.