This inventor holds 5 USPTO granted patents. Top assignees: Siemens Aktiengesellschaft, Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh & Co. Kg. Active years: 1980-2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
4 out of 30,874 
1 out of 38 
Years Active: 1980-2008
Title: Innovator Spotlight: Guy LeFranc - Pioneering Inventor from Munich
Introduction:
Guy LeFranc, a distinguished inventor based in Munich, Germany, has made significant contributions to the field of bonding wire technology and substrates for high-voltage modules. With a portfolio of 5 patents to his name, Guy LeFranc is recognized for his innovative solutions in the realm of electronic components.
Latest Patents:
Among Guy LeFranc's latest patents is a groundbreaking invention related to bonding wire and bonded connection. This unique bonding wire consists of a matrix material with a filler embedded in it, boasting a lower coefficient of thermal expansion than the matrix material. Notably, the filler content in this bonding wire comprises at least 25% of its total weight. Additionally, Guy LeFranc's work on substrates for high-voltage modules showcases a metallic-ceramic substrate featuring a high-impedance layer that ensures an even distribution of electrical potential across the surface.
Career Highlights:
Guy LeFranc has honed his expertise and showcased his inventive prowess through his association with esteemed companies such as Siemens Aktiengesellschaft and Eupec Europaeische Gesellschaft Fur Leistungshalbleiter Mbh. His innovative spirit and dedication to technological advancement have propelled him to the forefront of the industry.
Collaborations:
Throughout his illustrious career, Guy LeFranc has collaborated with notable individuals in the field, including Isolde Dietrich and Fred Fox. Together, they have spearheaded cutting-edge projects and paved the way for revolutionary developments in electronic component design and manufacturing.
Conclusion:
In conclusion, Guy LeFranc stands as a beacon of innovation in the realm of electronic components, with his pioneering inventions revolutionizing the industry. His profound impact on bonding wire technology and substrates for high-voltage modules underscores his exceptional talent and unwavering commitment to pushing the boundaries of technological advancement.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile