Company Filing History:
Years Active: 1983-2003
Title: Gustav Wirz: Innovator in Electronic Component Encapsulation
Introduction
Gustav Wirz is a notable inventor based in Berg, Switzerland. He has made significant contributions to the field of electronic component encapsulation, holding a total of 5 patents. His innovative methods and devices have advanced the technology used in semiconductor chip encapsulation.
Latest Patents
One of his latest patents is a method and device for encapsulating an electronic component, particularly a semiconductor chip. This invention involves fastening the component at a distance onto a flat substrate, with an elastomer layer deposited on the substrate to compensate for differing thermal expansion coefficients. The process includes depositing a buffer material and/or adhesive, placing the component onto it at room temperature, and subjecting the adhesive to precuring before final curing. The component is then connected to contact locations on the substrate, and all remaining hollow spaces, including electrical leads, are encased with a protective mass.
Another significant patent by Wirz is a method and device for receiving, orientating, and assembling components. In this invention, workpieces such as chips are removed from a receiving plane by a transfer unit and transported in two segments during two phases. The transfer unit features two working heads that simultaneously transport workpieces, allowing for efficient handling and orientation at an intermediate station.
Career Highlights
Gustav Wirz has worked with several companies throughout his career, including Alphasem AG and Les Fabriques D'Assortiments Réunies S.A. His experience in these organizations has contributed to his expertise in the field of electronic components.
Collaborations
Wirz has collaborated with notable coworkers such as Wolfgang Herbst and Heinz Ritzmann. Their combined efforts have furthered advancements in the technology surrounding electronic component encapsulation.
Conclusion
Gustav Wirz is a distinguished inventor whose work has significantly impacted the field of electronic component encapsulation. His innovative patents and collaborations highlight his contributions to advancing technology in this area.