Alphasem Ag

Les Fabriques D'assortiments Reunies S.a.

Kulicke and Soffa Die Bonding Gmbh

Gustav Wirz

Wolfgang Herbst

Franco Pizzagalli

Heinz Ritzmann

Martin Forster

For encapsulating an electronic component, in particular a semiconductor chip the component ( ) at a distance is fastened onto a flat substrate ( ). For this on the substrate there is deposited an elastomer layer ( ) which compensates the differing thermal expansion coefficients between the substrate and the component. A buffer material and/or an adhesive in liquid or pasty form is deposited from a dispenser and the component at room temperature is placed onto the buffer material and/or the adhesive. Before the final curing the buffer material and/or the adhesive is firstly subjected to a precuring. Subsequently the component by way of electrical leads is connected to contact locations on the substrate and lastly there is effected an encasing of all remaining hollow spaces including the electrical leads, with a protective mass.

Method and device for encapsulating an electronic component in particular a semiconductor chip

Workpieces such as chips are removed from a receiving plane by a transfer unit, which carries them to a delivery plane. The workpieces are transported in two segments during two phases, each workpiece being deposited between the phases on an intermediate station arranged in the region of the feed path. The transfer unit has two working heads, which simultaneously transport one workpiece from the receiving plane to the intermediate station, and another workpiece from the intermediate station to the delivery plane. The workpiece can be pivoted or rotated at the intermediate station so that its lower surface can be grasped by the depositing head.

Method and device for receiving, orientating and assembling of components

A metering apparatus has a metering chamber which has at least one boundary surface in the form of a flexible diaphragm. The diaphragm is operatively connected to an actuating device so that the volume of the chamber for metering and deliveirng the substance can be varied. An inlet opening and an outlet opening in the metering chamber can preferably be closed off directly by the diaphragm, more specifically by means of closure devices arranged in the region of those openings. The metering apparatus is particularly suitable for die bonders for the delivery of a bonding agent onto a substrate which is then equipped with electronic components.

Metering apparatus for metering and delivering fluid or pasty substances

A drive arm is guided in a play-free and low-friction manner in a guide slot in a driven arm. The guide slot has two side edges which are arranged in displaced relationship with each other. Arranged on the driven arm are two rolling members, wherein a respective rolling member is associated with each side edge. At least one of the side edges is in the form of a spring bar portion so that the two rolling members roll against their side edges under a spring biasing effect.

Transmission arrangement, in particular a maltese transmission

Installation for the sawing of wafers of semiconductor material encompassing an alignment station (1), a sawing station (9), and a cleaning station (7). A handling device, provided to convey the wafers from one station to another, while ensuring a perfect positioning under the disc (11) of the saw, encompasses at least two supporting platforms (2, 13), of a mobile table (14) and a transfer angle-iron (15). Platforms (2) and (13) are provided to retain a wafer by suction, whether the platforms are carried by fixed support (6) or by mobile table (14).

Growing community of inventors

Berg, Switzerland

Gustav Wirz