Company Filing History:
Years Active: 1996-2001
Title: Innovations by Gus Karavakis in Semiconductor Technology
Introduction
Gus Karavakis is a notable inventor based in Coram, NY (US), recognized for his contributions to semiconductor technology. With a total of 4 patents to his name, he has made significant advancements in the field, particularly in the area of semiconductor chip connection components.
Latest Patents
One of his latest patents focuses on semiconductor chip connection components with adhesives and methods of making the same. This innovation provides a semiconductor chip connection component that features an adhesive in a solid, non-tacky condition on its bottom surface. The adhesive is strategically applied in a pattern that covers less than the entire bottom surface of the component, ensuring a void-free interface when bonding to the chip's top surface. The adhesive is designed to become flowable through heat transferred from the chip itself. Additionally, the connection component includes leads with base metal strips and noble metal portions, encapsulated in a flowable, curable material, allowing for a void-free encapsulation process.
Career Highlights
Gus Karavakis is currently associated with Adeia Semiconductor Bonding Technologies Inc., where he continues to innovate in semiconductor bonding technologies. His work has been instrumental in enhancing the efficiency and reliability of semiconductor connections.
Collaborations
Throughout his career, Gus has collaborated with talented individuals such as Thomas H DiStefano and Zlata Kovac, contributing to the advancement of semiconductor technologies.
Conclusion
Gus Karavakis stands out as a significant figure in the semiconductor industry, with his innovative patents paving the way for future advancements. His work exemplifies the importance of innovation in technology and its impact on the industry.