Company Filing History:
Years Active: 2025
Title: Guopeng Zeng: Innovator in Die-Bonding Technology
Introduction
Guopeng Zeng is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of die-bonding technology. His innovative approach has led to the development of a unique die-bonding machine that enhances efficiency in the manufacturing process.
Latest Patents
Guopeng Zeng holds 1 patent for his invention of a die-bonding machine. This machine includes several key components: a transferring unit that supports and transfers a substrate to a bonding position, a feeding unit that positions and supplies the substrate, and a die supply unit that supports a die ring and supplies dies to a designated position. Additionally, it features a turret mechanism for transferring dies and a piercing mechanism for pushing the die to the turret mechanism.
Career Highlights
Guopeng Zeng is associated with Shenzhen Xinyichang Technology Co., Ltd., where he applies his expertise in die-bonding technology. His work has been instrumental in advancing the capabilities of manufacturing processes in the industry.
Collaborations
Guopeng Zeng collaborates with talented individuals such as Xinrong Hu and Gang Huang. Their combined efforts contribute to the innovative environment at Shenzhen Xinyichang Technology Co., Ltd.
Conclusion
Guopeng Zeng's contributions to die-bonding technology exemplify the spirit of innovation. His work not only enhances manufacturing efficiency but also showcases the potential of inventive minds in the industry.