The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Apr. 25, 2022
Shenzhen Xinyichang Technology Co., Ltd, Shenzhen, CN;
Xinrong Hu, Shenzhen, CN;
Gang Huang, Shenzhen, CN;
Guopeng Zeng, Shenzhen, CN;
Chuxiong Yan, Shenzhen, CN;
SHENZHEN XINYICHANG TECHNOLOGY CO., LTD, Shenzhen, CN;
Abstract
The application provides a die-bonding machine, including: a transferring unit used to support and transfer a substrate to a bonding position; a feeding unit used to position and supply the substrate to the transferring unit; a die supply unit used to support a die ring and supply dies to a die supply position; a die ring supply unit used to supply full die rings to the die supply unit and recover empty die rings in the die supply unit; a turret mechanism for transferring the dies in the die supply position to a die extraction position; a piercing mechanism for downwardly piercing a blue film of a die on the die supply position to push the die to the turret mechanism; and, and a die-bonding mechanism.