This inventor holds 5 USPTO granted patents and 7 published patent applications. Top assignees: Boe Technology Group, Chengdu Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.. Active years: 2025-2026.
Company Filing History:
4 out of 1,437 
4 out of 441 
1 out of 18,296 
Years Active: 2025-2026
Title: Guodong Zeng: Innovator in Circuit Board Technology
Introduction
Guodong Zeng is a notable inventor based in Beijing, China. He has made significant contributions to the field of circuit board technology. His innovative ideas have led to the development of a unique circuit board structure and display device.
Latest Patents
Guodong Zeng holds a patent for a circuit board structure and a display device. The circuit board structure includes a first circuit board, a second circuit board, a filling portion, and an electromagnetic shield layer. The second circuit board has a thickness greater than that of the first circuit board. At least one corner portion forms at a joint of the first circuit board and the second circuit board. A connection line forms at a joint of the second circuit board and the first circuit board, located at the corner portion. The filling portion fills the corner portion, with an extending direction identical to that of the corner portion. The thickness of a cross-section of the filling portion increases as the distance from the second circuit board decreases.
Career Highlights
Guodong Zeng has worked with prominent companies in the technology sector. He has been associated with Chengdu Boe Optoelectronics Technology Co., Ltd. and Boe Technology Group Co., Ltd. His experience in these organizations has contributed to his expertise in circuit board innovations.
Collaborations
Some of Guodong Zeng's coworkers include Liang Gao and Ajuan Du. Their collaboration has likely fostered a creative environment for developing advanced technologies.
Conclusion
Guodong Zeng is a distinguished inventor whose work in circuit board technology has made a significant impact. His patent reflects his innovative approach to solving complex engineering challenges.