Province, China

Guobing Jiang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Realtek Semiconductor Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Guobing Jiang. Retrieved from https://idiyas.com/inventor/guobing-jiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Guobing Jiang: Innovator in SSIC Technology

Introduction

Guobing Jiang is a notable inventor based in Province, China. He has made significant contributions to the field of semiconductor technology, particularly with his innovative work on the SSIC device.

Latest Patents

Guobing Jiang holds a patent for the SSIC device and link control method for SSIC devices. This invention involves a SuperSpeed Inter-Chip (SSIC) device that includes a detecting circuit capable of executing detection processes to identify SSIC compatible objects. The device can determine whether these objects meet specific states, such as de-link and re-link states, and generate control signals accordingly. This technology enhances the efficiency of connections between SSIC devices and hosts.

Career Highlights

Guobing Jiang is currently employed at Realtek Semiconductor Inc., where he continues to develop and refine his innovative ideas. His work has positioned him as a key player in the semiconductor industry, contributing to advancements in high-speed data transfer technologies.

Collaborations

Guobing has collaborated with talented coworkers, including Wei Qian and Chen Shen, who have supported his research and development efforts.

Conclusion

Guobing Jiang's contributions to SSIC technology exemplify the innovative spirit of modern inventors. His patent reflects a commitment to advancing semiconductor technology, which is crucial for the future of high-speed data communication.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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