Cologne, Germany

Gunther Reichert


Average Co-Inventor Count = 2.4

ph-index = 3

Forward Citations = 47(Granted Patents)


Location History:

  • Cologne, DE (1990 - 1994)
  • Koln, DE (1996)

Company Filing History:


Years Active: 1990-1996

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6 patents (USPTO):Explore Patents

Title: Gunther Reichert: Innovator in Metallization Technologies

Introduction

Gunther Reichert is a notable inventor based in Cologne, Germany. He has made significant contributions to the field of metallization technologies, holding a total of 6 patents. His work focuses on innovative formulations and processes that enhance the metallization of substrate surfaces.

Latest Patents

Reichert's latest patents include groundbreaking advancements in spray powder formulations. These formulations allow for the deposition of firmly adhering layers of metal through currentless, wet-chemical metallization. The essential components of these formulations consist of a pulverulent, non-conductive material and (semi-) noble metal compounds. Another significant patent involves a hydroprimer for metallizing substrate surfaces. This formulation, which contains a water-dispersible polymer and a metallization catalyst, is particularly effective for pretreating various substrate surfaces before metallization in a currentless bath.

Career Highlights

Gunther Reichert is associated with Bayer Aktiengesellschaft, a leading company in the field of chemical and pharmaceutical innovations. His work at Bayer has allowed him to develop and refine his patented technologies, contributing to advancements in metallization processes.

Collaborations

Reichert has collaborated with esteemed colleagues such as Gerhard-Dieter Wolf and Ulrich Von Gizycki. These partnerships have fostered a collaborative environment that enhances innovation and the development of new technologies.

Conclusion

Gunther Reichert's contributions to metallization technologies through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in substrate surface treatments and metallization processes.

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