Munich, Germany

Gunter Weiss

This inventor holds 1 USPTO granted patent. Top assignee: Redland Technologies Limited. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gunter Weiss. Retrieved from https://idiyas.com/inventor/gunter-weiss-k7bp3x5o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Gunter Weiss - Innovator in Collation Assemblies

Introduction

Gunter Weiss is a notable inventor based in Munich, Germany. He has made significant contributions to the field of technology, particularly in the area of collation assemblies. His innovative work has led to the development of a patent that showcases his expertise and creativity.

Latest Patents

Gunter Weiss holds a patent for collation assemblies. This invention reflects his commitment to advancing technology and improving existing systems. His patent is a testament to his skills as an inventor and his ability to address complex challenges in the industry. He has 1 patent to his name.

Career Highlights

Gunter Weiss is currently employed at Redland Technologies Limited, where he continues to innovate and contribute to the company's success. His role at the company allows him to collaborate with other talented professionals and push the boundaries of technology.

Collaborations

Gunter has worked alongside notable colleagues such as Frank Wojtalewicz and Helmut Rapp. These collaborations have enriched his experience and fostered a creative environment for innovation.

Conclusion

Gunter Weiss is a distinguished inventor whose work in collation assemblies has made a significant impact in the field. His dedication to innovation and collaboration with talented professionals highlights his importance in the technology sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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