Henan, China

Guanwen Qian

This inventor holds 1 USPTO granted patent. Top assignee: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Guanwen Qian. Retrieved from https://idiyas.com/inventor/guanwen-qian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Guanwen Qian

Introduction

Guanwen Qian is a notable inventor based in Henan, China. He has made significant contributions to the field of grinding technology, particularly through his innovative patent related to composite binding agent grinding wheels. His work has implications for various industries, especially in the processing of silicon carbide crystal epitaxial wafers.

Latest Patents

Guanwen Qian holds a patent for a composite binding agent grinding wheel and its preparation method. This invention involves a specific weight percentage of raw materials, including 45-65% pretreatment abrasive, 8-20% resin bonding agent, 5-12% hexagonal boron nitride, 5-10% silicon dioxide, 5-15% ceramic powder, 6-12% prealloy powder bonding agent, and 1-3% boron powder. The grinding wheel developed from this patent achieves nano-level grinding surface quality, demonstrating strong self-sharpening and high sharpness. It addresses the limitations faced in the back thinning processing of silicon carbide crystal epitaxial wafers.

Career Highlights

Guanwen Qian is associated with the Zhengzhou Research Institute for Abrasives and Grinding Co., Ltd. His role at this institute has allowed him to focus on research and development in abrasive technologies. His innovative approach has led to advancements that enhance the efficiency and effectiveness of grinding

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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