Guanwei Liang

Title: Innovations of Guanwei Liang

Introduction

Guanwei Liang is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of welding methods, particularly focusing on ceramic substrates. His innovative approach has led to the development of a unique welding method that enhances electrical connections in electronic devices.

Latest Patents

Guanwei Liang holds a patent for a "Welding method of demetallized ceramic substrate having surface capillary microgroove structure." This invention discloses a method that involves fixing a chip to the upper surface of a demetallized ceramic substrate, which features surface capillary microgroove structures. The process includes placing melted solder on a bonding pad and utilizing capillary force to drive the solder to ascend to the chip's electrode, thereby achieving an electrical connection with the printed circuit board.

Career Highlights

Throughout his career, Guanwei Liang has worked with prominent institutions such as South China University of Technology and Guangdong Luckystar Electronic Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic technology.

Collaborations

Guanwei Liang has collaborated with several professionals in his field, including Zongtao Li and Yong Zhao Tang. These collaborations have fostered a productive environment for innovation and development in welding methods.

Conclusion

Guanwei Liang's contributions to the field of welding methods, particularly through his patented innovations, demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future developments.