This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2022.
Company Filing History:
Years Active: 2022
Title: Guanhong Ye: Innovator in Chip Package Technology
Introduction
Guanhong Ye is a notable inventor based in Taiwan, CN, recognized for his contributions to chip package technology. With a focus on enhancing the efficiency and thermal management of chip packages, Ye has made significant strides in the field of electronics.
Latest Patents
Guanhong Ye holds a patent for a chip package device. This innovative device includes a chip, a first substrate, and a second substrate that are positioned opposite each other. The chip is mounted on a surface of the first substrate that faces the second substrate. It is electrically connected to the first substrate through a first conductive part. Additionally, the first substrate is connected to the second substrate via a second conductive part. A heat dissipation passage is created between the chip and the second substrate through a thermally conductive layer. This design allows for efficient heat dissipation, ensuring that the chip maintains a normal operating temperature. The device may also include a molding compound that wraps the chip, further enhancing its functionality.
Career Highlights
Guanhong Ye is currently employed at Huawei Technologies Co., Limited, where he continues to innovate and develop advanced technologies in the field of electronics. His work has contributed to the company's reputation as a leader in technology and innovation.
Collaborations
Some of his notable coworkers include Jiajie Tang and Laicun Lin, with whom he collaborates on various projects within the company.
Conclusion
Guanhong Ye's contributions to chip package technology exemplify the importance of innovation in the electronics industry. His patented designs not only improve performance but also enhance the thermal management of electronic devices.