Beijing, China

Guangfeng Bai

This inventor holds 1 USPTO granted patent. Top assignees: Ccri (Beijing) New Material Technology Co., Ltd., Ccteg China Coal Research Institute. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Guangfeng Bai. Retrieved from https://idiyas.com/inventor/guangfeng-bai-5qdqfds3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Guangfeng Bai and His Mining Reinforcement Filler Patent.

Introduction

Guangfeng Bai is an inventor based in Beijing, China. His work includes an invention concerning materials for reinforcing mining applications.

Latest Patents

Bai is associated with 1 patent, titled “Method for Preparing Grouting Reinforcement Filler for Mining.” The patent describes a two-component grouting reinforcement filler and a method for preparing it. The first component contains a polyol polymer, catalyst, foaming agent, and surfactant. The second component contains polyisocyanate, modifier, plasticizer, and reactive flame retardant. The disclosure specifies weight ranges for each ingredient, providing a formulation intended for mining reinforcement.

Career Highlights

Bai is associated with CCTEG China Coal Research Institute and CCTEG (Beijing) New Material Technology Co., Ltd. His patent focuses on developing a specialized filler for grouting reinforcement in mining.

Collaborations

Bai’s listed coworkers include Xiaofeng Yu and Yuchao Wang.

Conclusion

Guangfeng Bai’s patent documents a two-component grouting reinforcement filler formulation for mining, reflecting his work in materials and mining-related technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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