This inventor holds 2 USPTO granted patents. Top assignee: Unisem (M) Berhad. Active years: 2015-2016.
Company Filing History:
Years Active: 2015-2016
Title: Innovations by Guan JunHua
Introduction
Guan JunHua is a notable inventor based in Chengdu, China. He has made significant contributions to the field of Micro-Electro-Mechanical Systems (MEMS) technology. With a total of two patents to his name, his work showcases his expertise and innovative spirit.
Latest Patents
Guan JunHua's latest patent is titled "Top port MEMS cavity package and method of manufacture thereof." This invention describes a method for manufacturing a package that encases a MEMS device. The design includes a cover with a lid and sidewalls, featuring a port that extends through the lid. A first base component is bonded to the sidewalls, defining an internal cavity. This component also includes an aperture that allows the MEMS device to be inserted and bonded to the lid, partially overlapping the port. The assembly is completed by bonding a second base component to seal the aperture, resulting in a package that effectively protects and interconnects the MEMS device.
Career Highlights
Guan JunHua is currently employed at Unisem (M) Berhad, where he continues to innovate in the MEMS field. His work has contributed to advancements in packaging technology for MEMS devices, enhancing their performance and reliability.
Collaborations
Guan JunHua has collaborated with notable colleagues such as Rob Protheroe and Alan Evans. Their combined expertise has fostered a productive environment for innovation and development in their projects.
Conclusion
Guan JunHua's contributions to MEMS technology through his patents and collaborations highlight his role as a significant inventor in the field. His innovative methods continue to shape the future of MEMS packaging solutions.