logo

For the Inventor, By the Inventor

Meridian, ID, United States of America

Gregory M Chapman

USPTO Granted Patents = 28

Average Co-Inventor Count = 1.9

ph-index = 7

Forward Citations = 542(Granted Patents)


Location History:

  • Boise, ID (US) (1994)
  • Meridian, ID (US) (1990 - 2010)

Company Filing History:

goldMedal28 out of 37,950 
 
Micron Technology Incorporated
 patents

Years Active: 1990-2010

Loading Chart...
28 patents (USPTO):Explore Patents
1. 7677429 - Concave face wire bond capillary and method (2010-03-16),
2. 7416107 - Concave face wire bond capillary and method (2008-08-26),
3. 7271018 - Method of forming a support frame for semiconductor packages (2007-09-18),
4. 7087133 - Methods for application of adhesive tape to semiconductor devices (2006-08-08),
5. 7087116 - Apparatus for modifying the configuration of an exposed surface of a viscous fluid (2006-08-08),
6. 6966480 - Concave face wire bond capillary and method (2005-11-22),
7. 6956272 - Support frame for semiconductor packages (2005-10-18),
8. 6890384 - Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid (2005-05-10),
9. 6883574 - Apparatus for application of adhesive tape to semiconductor devices (2005-04-26),
10. 6818460 - Method for applying adhesives to a lead frame (2004-11-16),
11. 6787382 - Method and system for singulating semiconductor components (2004-09-07),
12. 6744134 - Use of a reference fiducial on a semiconductor package to monitor and control a singulation method (2004-06-01),
13. 6683378 - System for singulating semiconductor components utilizing alignment pins (2004-01-27),
14. 6638831 - Use of a reference fiducial on a semiconductor package to monitor and control a singulation method (2003-10-28),
15. 6623592 - Methods for application of adhesive tape to semiconductor devices (2003-09-23),

Title: Gregory M. Chapman: Innovator in Semiconductor Bonding Technology

Introduction

Gregory M. Chapman, based in Meridian, ID, has made significant contributions to the field of semiconductor technology through his innovative inventions. With an impressive portfolio of 28 patents, his work showcases his commitment to advancing wire bonding techniques, which are essential for the functionality of semiconductor devices.

Latest Patents

Among his latest inventions is the "Concave Face Wire Bond Capillary and Method." This innovative wire bonding capillary enhances the bonding of wires to both the bond pads of semiconductor devices and the leads of lead frames. The capillary features a unique working tip that includes a flat annular portion surrounding the wire feed aperture, transitioning into a concave surface that optimizes performance. This development aims to improve efficiency and reliability in semiconductor applications.

Career Highlights

Gregory is a key member of Micron Technology Incorporated, where he has played a vital role in advancing the company's technological capabilities. His contributions are pivotal in ensuring that Micron maintains its position as a leader in memory and storage solutions.

Collaborations

Throughout his career, Gregory has collaborated with talented professionals such as Michael J. Bettinger and Jennifer A. Due. Together, they have worked on various projects, pushing the boundaries of semiconductor bonding technology further, enhancing Micron's product offerings.

Conclusion

Gregory M. Chapman exemplifies the spirit of innovation in the semiconductor industry. His extensive patent portfolio and collaborations highlight his dedication to developing cutting-edge solutions that influence the future of technology. As advancements in this field continue to emerge, inventors like Gregory play a crucial role in shaping the landscape of modern electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…