Gregory A Miller

Title: Innovations of Gregory A. Miller in Semiconductor Technology

Introduction

Gregory A. Miller is a notable inventor based in Mount Prospect, IL (US), recognized for his contributions to semiconductor technology. With a total of 3 patents, he has made significant advancements in the field, particularly in the development of ultra-thin semiconductor devices.

Latest Patents

Miller's latest patents include innovations related to thin semiconductor devices that feature embedded die support. These ultra-thin semiconductor devices, which include piezoresistive sensing elements, can be formed in a wafer stack that facilitates the handling of many thin device dice at a wafer level. His patents describe three different fabrication techniques: anodic bonding, adhesive bonding, and fusion bonding. A trench is etched around each thin die to separate it from others in the wafer stack. Additionally, a tether layer is utilized to hold the thin dice together, enabling easier die picking during packaging processes.

Career Highlights

Gregory A. Miller is currently employed at Continental Automotive Systems Corporation, where he continues to innovate in the semiconductor space. His work has contributed to advancements that enhance the efficiency and effectiveness of semiconductor devices.

Collaborations

Miller has collaborated with notable coworkers, including Xiaoyi Ding and Jeffrey J. Frye, who have also contributed to the field of semiconductor technology.

Conclusion

Gregory A. Miller's work in semiconductor technology exemplifies innovation and collaboration, making significant strides in the development of ultra-thin devices. His contributions continue to impact the industry positively.