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For the Inventor, By the Inventor

Endwell, NY, United States of America

Gregg J Armezzani

USPTO Granted Patents = 11

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 51(Granted Patents)


Company Filing History:

goldMedal11 out of 164,219 
 
International Business Machines Corporation
 patents

Years Active: 1998-2003

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11 patents (USPTO):Explore Patents
1. 6653575 - Electronic package with stacked connections and method for making same (2003-11-25),
2. 6617528 - Electronic package with stacked connections and method for making same (2003-09-09),
3. 6574113 - Electronic package with stacked connections and method for making same (2003-06-03),
4. 6452116 - Use of blind vias for soldered interconnections between substrates and printed wiring boards (2002-09-17),
5. 6281437 - Method of forming an electrical connection between a conductive member having a dual thickness substrate and a conductor and electronic package including said connection (2001-08-28),
6. 6272742 - Method of electrically connecting substrates using solder balls (2001-08-14),
7. 6198634 - Electronic package with stacked connections (2001-03-06),
8. 6187610 - Flexible thin film ball grid array containing solder mask (2001-02-13),
9. 6023029 - Use of blind vias for soldered interconnections between substrates and (2000-02-08),
10. 5884397 - Method for fabricating chip carriers and printed circuit boards (1999-03-23),
11. 5818697 - Flexible thin film ball grid array containing solder mask (1998-10-06),

Title: The Innovations of Gregg J Armezzani

Introduction

Gregg J Armezzani is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of electronics, holding a total of 11 patents. His work primarily focuses on electronic packaging and semiconductor technologies.

Latest Patents

One of his latest patents is titled "Electronic package with stacked connections and method for making same." This invention describes an electronic package that includes first and second circuitized substrates secured together by a solder member. The solder member features a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together, facilitating the formation of a multi-chip module. Additionally, semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Career Highlights

Gregg J Armezzani is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His expertise in electronic packaging has positioned him as a key player in the industry.

Collaborations

Some of his notable coworkers include Matthew Aaron Heller and Kishor V Desai, who have collaborated with him on various projects.

Conclusion

Gregg J Armezzani's contributions to electronic packaging and semiconductor technologies have made a significant impact in the field. His innovative patents and work at IBM highlight his dedication to advancing technology.

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