The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Nov. 10, 1999
Steven W. Anderson, Newark Valley, NY (US);
Gregg J. Armezzani, Endwell, NY (US);
Daniel P. Labzentis, Apalachin, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electrical connection between a flexible circuitized substrate and a separator conductor is formed wherein the substrate's dielectric member has a region of reduced thickness immediately adjacent the portion of the substrate's conductor that is being connected (e.g., using thermocompression bonding) to the separate conductor (e.g., a chip's contact site or a solder ball thereon). Heat and pressure is applied to form the bond between both conductors, this heat passing through the reduced thickness dielectric while appropriate pressure is applied. The reduced thickness assures heat flow (and possibly displacement of the dielectric in this region, e.g., it “melts back”) to thus facilitate bond formation, but also is able to positively retain several conductors of the substrate in spaced alignment during the bonding to respective solder balls or chip contact sites.