Bloomington, MN, United States of America

Grant W Effertz

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Geospan Corporation. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Grant W Effertz. Retrieved from https://idiyas.com/inventor/grant-w-effertz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021-2026

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2 patents (USPTO):Explore Patents

Title: Grant W. Effertz: Innovator in 3D Geographic Information Systems

Introduction

Grant W. Effertz is a notable inventor based in Bloomington, MN (US), recognized for his contributions to the field of geographic information systems (GIS). He holds 2 patents that focus on the management and modeling of 3D structures, showcasing his innovative approach to technology.

Latest Patents

Effertz's latest patents include a "Shared Geographic Information System for Creation, Change Management and Delivery of 3D Structure Models." This patent describes a new generation 3D modeling system designed for managing the 3D characteristics of man-made structures within a shared GIS platform. The system allows for the conversion of 2D GIS topology into 3D real-world topology, enabling users to create and maintain 3D models and non-graphical attribute data over time. It is managed by a community of users based on a series of permissions and user roles. Additionally, the system integrates 3D model data with attribute data, which can be supplemented with published map or attribute data and/or data provided by users of the system.

Another significant patent is the "Geographic Information System for Creating 3D Structure Models Using Perspective View Drafting." Similar to his previous work, this patent outlines a 3D modeling system that facilitates the management of 3D characteristics of structures in a GIS platform. It also supports the conversion of 2D GIS topology to 3D real-world topology, allowing for the ongoing maintenance of 3D models and associated data.

Career Highlights

Grant W. Effertz is currently associated with Geospan Corporation, where he applies his expertise in GIS and 3D modeling. His work has significantly advanced the capabilities of GIS technology, making it more accessible and user-friendly for various applications.

Collaborations

Effertz has collaborated with notable colleagues, including Stephen Boggs and Theodore M. Lachinski, contributing to the development of innovative solutions in the field of geographic information systems.

Conclusion

Grant W. Effertz's work in 3D geographic information systems exemplifies the intersection of technology and innovation. His patents reflect a commitment to enhancing the management of 3D structures, making significant strides in the GIS industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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