Grace A Rivas

Title: Grace A Rivas: Innovator in Electroformed Technology

Introduction

Grace A Rivas is a notable inventor based in Claremont, CA (US). She has made significant contributions to the field of electroformed technology, particularly in the production of copper lead frame tapes. Her innovative approach has led to advancements that enhance the quality and efficiency of electronic components.

Latest Patents

Grace A Rivas holds a patent for the "Electroformed and chemical milled bumped tape process." This process involves creating a copper lead frame tape where individual fingers are equipped with gold-plated bumps. The method utilizes a copper foil with dry film photoresist on both sides, allowing for precise electroforming and chemical milling. The result is a plurality of fingers, each featuring an integral bump/copper foil arrangement, with bump heights reaching up to 0.0013 inch or greater.

Career Highlights

Grace A Rivas is associated with General Dynamics Corp., Pomona Division, where she has applied her expertise in electroforming technology. Her work has been instrumental in developing processes that improve the manufacturing of electronic components.

Collaborations

Throughout her career, Grace has collaborated with esteemed colleagues such as William P Dugan and Rama P Samudrala. These partnerships have fostered innovation and contributed to the success of her projects.

Conclusion

Grace A Rivas exemplifies the spirit of innovation in the field of electroformed technology. Her contributions have not only advanced manufacturing processes but have also set a standard for quality in electronic components.