Company Filing History:
1 out of 16,338 
1 out of 1 Years Active: 2004-2005
Title: Innovations by Govindasamy Paramasivan Rajendran
Introduction
Govindasamy Paramasivan Rajendran is an accomplished inventor based in Boothwyn, PA (US). He has made significant contributions to the field of materials science, particularly in the development of advanced dielectric materials and crystallization processes.
Latest Patents
Rajendran holds 2 patents that showcase his innovative work. His first patent focuses on a low loss dielectric material for printed circuit boards and integrated circuit chip packaging. This invention involves fiber reinforced composite substrates that consist of a polymeric matrix and woven or non-woven para-aramid or fiberglass fabrics. The polymeric matrix is primarily made up of cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes, making it suitable for high-frequency circuits. His second patent describes a process for crystallizing a portion of a crystallizable condensation homopolymer to form solid particles. This process includes combining a major component of a crystallizable condensation homopolymer with a minor component of a non-crystallizable condensation polymer, followed by specific thermal treatments to achieve crystallization.
Career Highlights
Throughout his career, Rajendran has worked with notable companies such as E.I. DuPont de Nemours and Company and Invista North America S.à r.l. His experience in these organizations has allowed him to refine his expertise in polymer science and materials engineering.
Collaborations
Rajendran has collaborated with esteemed colleagues, including Pui-Yan Lin and George Elias Zahr. These partnerships have contributed to the advancement of his research and innovations.
Conclusion
Govindasamy Paramasivan Rajendran's work exemplifies the spirit of innovation in materials science. His patents reflect a commitment to developing advanced technologies that have practical applications in various industries.