E.i. Dupont De Nemours and Company

Invista North America S.&aacute;.r.l.

Govindasamy Paramasivan Rajendran

Kenneth Wayne Leffew

George Elias Zahr

Pui-Yan Lin

Vivek Kapur

Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.

Low loss dielectric material for printed circuit boards and integrated circuit chip packaging

A process for forming solid particles comprising the steps of: combining in molten form a major component of a crystallizable condensation homopolymer and a minor component of a non-crystallizable condensation polymer, wherein the crystallizable condensation homopolymer and the non-crystallizable condensation polymer each have a degree of polymerization of 10 to less than 48 prior to the combining; mixing the combined crystallizable condensation homopolymer and non-crystallizable condensation polymer in molten form to form a mixture that comprises 10 to 30 mol % of the non-crystallizable condensation polymer; forming the mixture into droplets; exposing the droplets to a thermal environment which results in the bulk of the droplet reaching within 15 seconds a temperature within &plusmn;10&deg; C. of the temperature at which the maximum rate of crystallization of the crystallizable condensation homopolymer occurs; and crystallizing at least a portion of the crystallizable condensation homopolymer in the mixture to form solid particles.

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Boothwyn, PA, United States of America

Govindasamy Paramasivan Rajendran