Taichung, Taiwan

Gou-Jen Wang

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Other. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gou-Jen Wang. Retrieved from https://idiyas.com/inventor/gou-jen-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:

goldMedal1 out of 834,513 
Other
 patents

Years Active: 2003

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Gou-Jen Wang in Chemical-Mechanical Polishing

Introduction

Gou-Jen Wang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of chemical-mechanical polishing (CMP), particularly through his innovative methods that enhance efficiency and output quality.

Latest Patents

Wang holds a patent for a "Method for determining efficiently parameters in chemical-mechanical polishing (CMP)." This method utilizes a Neural-Taguchi approach to identify the optimal parameter set that maximizes output. The invention incorporates a time parameter for achieving end-point detection during the CMP process, ensuring both a maximum material removal rate (MRR) and minimal within wafer non-uniformity (WIWNU) simultaneously. He has 1 patent to his name.

Career Highlights

Throughout his career, Gou-Jen Wang has focused on advancing CMP techniques. His work has been instrumental in improving the efficiency of semiconductor manufacturing processes. His innovative approach has garnered attention in the industry, showcasing his expertise in the field.

Collaborations

Wang has collaborated with notable colleagues, including Jhy-Cherng Tsai and Jau-Liang Chen. Their combined efforts have contributed to the development of advanced methodologies in CMP.

Conclusion

Gou-Jen Wang's contributions to the field of chemical-mechanical polishing highlight his innovative spirit and dedication to enhancing manufacturing processes. His patent reflects a significant advancement in the industry, showcasing the importance of efficient parameter determination in CMP.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…