The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2003
Filed:
Apr. 06, 2001
Applicant:
Inventors:
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/900 ;
U.S. Cl.
CPC ...
G06F 1/900 ;
Abstract
A method of determining efficiently parameters in chemical-mechanical polishing, especially a method includes a Neural-Taguchi method to seek the best parameter set to increase the quantity of output. This invention involves a time parameter to achieve end-point detection on line during the CMP procedure and also completes a maximum material removal rate (MRR) and a minimum within wafer non-uniformity (WIWNU) at the same time.
Wang, Gou-Jen. (2003). Method for determining efficiently parameters in chemical-mechanical polishing (cmp) (U.S. Patent No. 6564116). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6564116
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile