West Henrietta, NY, United States of America

Gordon J Donahue

This inventor holds 1 USPTO granted patent. Top assignee: Voplex Corporation. Active years: 1984.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gordon J Donahue. Retrieved from https://idiyas.com/inventor/gordon-j-donahue

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 1984

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1 patent (USPTO):Explore Patents

Title: Gordon J Donahue: Innovator in Molding Technology

Introduction

Gordon J Donahue is a notable inventor based in West Henrietta, NY (US). He has made significant contributions to the field of molding technology, particularly with his innovative approach to creating resin exteriors over ball cores. His work has led to advancements in manufacturing processes that enhance product durability and efficiency.

Latest Patents

Gordon J Donahue holds a patent for a "Pin support and mold for foaming and curing resin exterior over ball core." This invention involves a molding apparatus that supports a tough, resin ball core within a spherical mold cavity. The design allows for the formation of a foamed resin exterior that fills the mold cavity, completing the spherical ball. The pin support mechanism ensures accurate placement of the core during the molding process and facilitates the curing of the ball after molding.

Career Highlights

Throughout his career, Donahue has been associated with Voplex Corporation, where he has applied his expertise in molding technology. His innovative designs have contributed to the company's reputation for quality and reliability in manufacturing.

Conclusion

Gordon J Donahue's contributions to molding technology exemplify the impact of innovation in manufacturing processes. His patent reflects a commitment to enhancing product quality and efficiency in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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