Company Filing History:
Years Active: 1999-2002
Title: Innovations of Gon-sub Lee in Silicon Technology
Introduction
Gon-sub Lee is a notable inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of silicon technology, particularly in the manufacturing of monocrystalline silicon ingots and wafers. With a total of four patents to his name, his work has implications for various applications in electronics and materials science.
Latest Patents
Gon-sub Lee's latest patents focus on the production of semi-pure and pure monocrystalline silicon ingots and wafers. His innovative method involves pulling the ingot from a silicon melt in a hot zone furnace in an axial direction. The pull rate profile is carefully controlled to prevent interstitial agglomerates while confining vacancy agglomerates to a vacancy-rich region at the ingot's axis. The resulting ingots are sliced into semi-pure wafers, which feature a vacancy-rich center and a pure region free of agglomerates. This method ensures that the wafers produced may include point defects but are devoid of both vacancy and interstitial agglomerates, enhancing their quality and usability.
Career Highlights
Gon-sub Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the field of silicon manufacturing. His work has not only advanced the technology but has also contributed to the efficiency and effectiveness of silicon wafer production.
Collaborations
He has collaborated with notable colleagues such as Kyoo-chul Cho and Jea-gun Park, further enhancing the research and development efforts within his team.
Conclusion
Gon-sub Lee's contributions to silicon technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His advancements in the manufacturing processes of silicon ingots and wafers are paving the way for future developments in electronics.