This inventor holds 2 USPTO granted patents. Top assignee: National Semiconductor Corporation. Active years: 2002-2003.
Company Filing History:
Years Active: 2002-2003
Title: Glenn Narvaez: Innovator in Semiconductor Packaging
Introduction
Glenn Narvaez is a prominent inventor based in Redwood City, CA. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative techniques and methods.
Latest Patents
Narvaez's latest patents focus on improving the manufacture and structure of leadframe chip scale packages and land grid array packages. One of the key aspects of his invention involves a method for patterning a conductive substrate, which is essential for forming a packaged semiconductor device. This method utilizes a metallic barrier layer and a second metallic layer as an etching resist. Additionally, he has developed techniques for treating a conductive leadframe with a CZ treatment and for implementing locking grooves within the studs of a studded leadframe. His work also includes substrate arrangements that enhance the environmental resistance of semiconductor packages, improving adhesion between the substrate and molding materials.
Career Highlights
Glenn Narvaez is currently employed at National Semiconductor Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing packaging technologies that are crucial for modern electronics.
Collaborations
Throughout his career, Narvaez has collaborated with notable colleagues such as Shaw Wei Lee and Thanh Lequang. These partnerships have contributed to the development of cutting-edge solutions in semiconductor packaging.
Conclusion
Glenn Narvaez is a key figure in the semiconductor industry, with a focus on innovative packaging solutions. His patents reflect his commitment to enhancing the performance and reliability of semiconductor devices.