Cream Ridge, NJ, United States of America

Glenn M Brady

This inventor holds 2 USPTO granted patents. Top assignee: Lucent Technologies Inc.. Active years: 2001-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Glenn M Brady. Retrieved from https://idiyas.com/inventor/glenn-m-brady

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2001-2002

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2 patents (USPTO):Explore Patents

Title: Glenn M. Brady and His Grounding Innovations.

Introduction

Glenn M. Brady is an inventor associated with Cream Ridge, New Jersey, and Lucent Technologies Inc. His work includes two patents focused on magnetic clamping and reliable electrical grounding for test equipment.

Latest Patents

Brady’s patents address ways to connect electrical apparatus securely to a metallic ground plane.

- **Magnetic Clamp Adaptor.** This adaptor uses a conductive baseplate and one or more clamp members to secure a ground plate flange. Its planar region is designed to work with a magnetic clamp device, helping establish a grounded connection to the metallic ground plane.

- **Magnetic Clamp Device.** This device uses a top plate, a spring-loaded bar, and a pair of magnet assemblies. The magnets straddle a conductive flange and attach to the ground plane, while the spring-loaded bar presses the flange into conductive contact.

Career Highlights

Brady’s listed patent portfolio comprises 2 patents. The inventions described here focus on making grounding connections for electrical test equipment quicker and more dependable.

Collaborations

Brady’s listed coworkers include Michael S. Ruduski and James Vincent Canzonier. His work is associated with Lucent Technologies Inc.

Conclusion

Glenn M. Brady’s patents demonstrate a practical approach to electrical grounding, combining magnetic attachment and mechanical clamping to create secure conductive connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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