Suwon, South Korea

Gilman Kang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2022.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovator Gilman Kang: Pioneering Advances in Thermal Compression Technology

Introduction: Gilman Kang, based in Suwon-si, South Korea, is an esteemed inventor known for his contributions to thermal compression technology. His innovative approach has led to the development of a unique bonding head that enhances the efficiency and effectiveness of bonding processes in various applications.

Latest Patents: Gilman holds a patent for a "Bonding Head and a Bonding Apparatus Having the Same." This invention focuses on a bonding head designed for performing a thermal compression process. It features a base body with a bonding heater that generates the necessary melting heat. The bonding tool, situated on the bonding heater, compresses a bonding object against a bonding base while transferring melting heat, effectively bonding the two through thermal compression. Additionally, a heat controller is incorporated in the bonding tool, which possesses lower thermal conductivity than the bonding tool itself, creating an optimal bonding environment.

Career Highlights: Gilman is a key member of Samsung Electronics Co., Ltd., where he applies his expertise to advance the company's technological capabilities. His experience and dedication have positioned him as a prominent figure within the organization, where innovation is a driving force.

Collaborations: Throughout his career, Gilman has collaborated with notable coworkers, including Jaecheol Kim and Yongdae Ha. Their combined efforts have fostered a collaborative environment that encourages innovative thinking and problem-solving, furthering the potential of their field.

Conclusion: Gilman Kang exemplifies the spirit of innovation through his contributions to bonding technology. His patent reflects a significant advancement that not only enhances performance but also paves the way for future developments in the industry. As a member of Samsung Electronics Co., Ltd., he continues to push the boundaries of technology, inspiring others in the realm of inventions and engineering.

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