Vailhauques, France

Gilles Granier

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2003.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2003

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Gilles Granier

Introduction

Gilles Granier is a notable inventor based in Vailhauques, France. He has made significant contributions to the field of thermocompression bonding technology. His work has implications for various applications, particularly in the electronics industry.

Latest Patents

Gilles Granier holds a patent for a method for making and testing thermocompression bonds. This innovative method involves positioning a wire and a contact or terminal lead between opposing electrodes. A direct current is passed through these components to create a direct attach thermocompression bond. The method includes a peel test to ensure that the bonds meet specified standards. This test involves securing the contact/terminal lead, bending the wire at a 90-degree angle, and applying a constant pull force until the bond is broken. The required peel force is then compared to a standard to verify compliance with specifications. An axial pull test may also be performed to further assess the bond's integrity.

Career Highlights

Gilles Granier is associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to contribute to advancements in technology and innovation. He has been recognized for his expertise in thermocompression bonding, which is crucial for ensuring reliable connections in electronic devices.

Collaborations

Gilles has collaborated with notable colleagues, including Kenneth Scea and Kent D Waddell. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Gilles Granier's contributions to thermocompression bonding technology highlight his role as an influential inventor. His patent and work at IBM demonstrate his commitment to advancing technology in the electronics field. His innovative methods continue to impact the industry positively.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…