Pretoria, South Africa

Gideon J Gouws

This inventor holds 1 USPTO granted patent. Top assignee: British Technology Group Limited. Active years: 1996.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 219(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Gideon J Gouws

Introduction

Gideon J Gouws is a notable inventor based in Pretoria, South Africa. He has made significant contributions to the field of electronics, particularly in the integration of circuits with substrates. His innovative approach has led to advancements in packaging technology, enhancing the functionality of electronic devices.

Latest Patents

Gouws holds a patent for a method of attaching an electronic circuit to a substrate. This patent involves adhering an integrated circuit to materials such as cardboard packaging. The process includes applying a patch antenna to both the substrate and the integrated circuit, followed by a sealing layer. Variations of this method allow for the formation of indentations in the substrate for the integrated circuit. The patch antenna can be screen printed using conductive ink or applied as a metallic foil. Notably, if the integrated circuit is a transponder, it can be programmed with an identification code before or after attachment.

Career Highlights

Gideon J Gouws is associated with British Technology Group Limited, where he continues to innovate and develop new technologies. His work has been instrumental in bridging the gap between electronic circuits and practical applications in packaging.

Collaborations

Gouws has collaborated with notable colleagues, including Michael J Marsh and Mark H Carson. Their combined expertise has contributed to the success of various projects within their field.

Conclusion

Gideon J Gouws exemplifies the spirit of innovation in electronics through his patent and work at British Technology Group Limited. His contributions are paving the way for future advancements in the integration of electronic circuits with everyday materials.

Profile summary based on public USPTO records.
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