Gianni Signorini

Title: Gianni Signorini: Innovator in Wafer-Level Packaging Technology

Introduction

Gianni Signorini is a prominent inventor based in Garching bei Muenchen, Germany. He has made significant contributions to the field of microelectronics, particularly in wafer-level packaging technology. With a total of four patents to his name, Signorini continues to push the boundaries of innovation in this specialized area.

Latest Patents

Among his latest patents is a method to implement wafer-level chip-scale packages with grounded conformal shields. This invention includes electronic packages with conformal shields and methods of forming such packages. In one embodiment, the electronic package comprises a die with a first surface, a second surface opposite the first surface, and sidewall surfaces. A redistribution layer is positioned over the first surface of the die, which includes a first conductive layer. Additionally, an under ball metallization (UBM) layer is placed over the redistribution layer, while a conductive shield is situated over the sidewall surfaces and the second surface of the die, electrically coupled to the UBM layer.

Another notable patent involves integrating and accessing passive components in wafer-level packages. This method outlines a microelectronic die package that includes a die and a package substrate attached to one side of the die, configured to connect to a system board. A plurality of passive devices is located over the second side of the die, along with passive device contacts designed to couple to a second die mounted over the passive devices.

Career Highlights

Gianni Signorini is currently employed at Intel Corporation, where he applies his expertise in microelectronics to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of wafer-level packaging, which is crucial for modern electronic devices.

Collaborations

Throughout his career, Signorini has collaborated with notable colleagues, including Georg Seidemann and Bernd Waidhas. These partnerships have fostered an environment of innovation and have contributed to the successful development of various technologies in the field.

Conclusion

Gianni Signorini is a key figure in the realm of wafer-level packaging technology, with a strong portfolio of patents that reflect his innovative spirit. His contributions at Intel Corporation and collaborations with esteemed colleagues highlight his commitment to advancing microelectronics.