Genoa, Italy

Gianni Paparella

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Telefonaktiebolaget Lm Ericsson (Publ). Active years: 2026.

USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Gianni Paparella: Innovator in Heat Sink Technology

Introduction

Gianni Paparella is a notable inventor based in Genoa, Italy. He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on enhancing the efficiency of heat sink apparatuses used in electronic devices.

Latest Patents

Gianni Paparella holds a patent for a "Heat sink apparatus for an interface module." This invention addresses the challenges associated with oscillations in heat sinks. The apparatus is designed to reduce the effects of these oscillations, ensuring better thermal performance. The heat sink apparatus includes a cage for a pluggable signal connector, which is coupled to a circuit board. The design features a dampener that mitigates oscillations, enhancing the reliability of electronic components.

Career Highlights

Gianni Paparella is associated with Telefonaktiebolaget Lm Ericsson (Publ), a leading telecommunications company. His role involves developing advanced thermal management solutions that are crucial for modern electronic systems. His innovative approach has led to improved performance and longevity of electronic devices.

Collaborations

Throughout his career, Gianni has collaborated with talented professionals such as Marco Assale and Claudio D'Incà. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Gianni Paparella's contributions to heat sink technology exemplify the importance of innovation in the electronics industry. His patent and collaborative efforts continue to influence the design and functionality of thermal management systems.

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