Geneva, IL, United States of America

Giaia Lee Ludwig

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Tegrant Alloyd Brands, Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Giaia Lee Ludwig. Retrieved from https://idiyas.com/inventor/giaia-lee-ludwig

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2014

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2 patents (USPTO):Explore Patents

Title: Innovations by Giaia Lee Ludwig

Introduction

Giaia Lee Ludwig is an accomplished inventor based in Geneva, IL (US). He has made significant contributions to the field of packaging technology, holding 2 patents that showcase his innovative approach to container design.

Latest Patents

Ludwig's latest patents include a "Two Component Vertical Sealing Blister Packaging" and a "Blister Packaging Container Sealing Tool and Method." The first patent describes a container that consists of a plastic blister or cover component with a first peripheral edge and a formed, first open-sided volume. This component is joined with a paperboard tray that has a second peripheral edge, creating a combined container volume. The second patent outlines a similar design, emphasizing the use of a wedge-shaped paperboard tray that allows for efficient filling and sealing on conventional blister packaging equipment.

Career Highlights

Giaia Lee Ludwig is currently employed at Tegrant Alloyd Brands, Inc., where he continues to develop innovative packaging solutions. His work has significantly impacted the efficiency and functionality of blister packaging.

Collaborations

Ludwig collaborates with talented coworkers, including Scott Niedzwiecki and Danny Corral, who contribute to the innovative environment at Tegrant Alloyd Brands, Inc.

Conclusion

Giaia Lee Ludwig's contributions to packaging technology through his patents reflect his dedication to innovation and efficiency in design. His work continues to influence the industry and improve packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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