Gernot Steinlesberger

Title: Innovations of Gernot Steinlesberger: Pioneering in Layer Arrangements

Introduction

Gernot Steinlesberger is a notable inventor based in Munich, Germany. With a background in engineering and technology, he has made significant contributions to the field through his innovative patents. Steinlesberger currently holds two patents that showcase his expertise in manufacturing layer arrangements and ultrathin metal layers.

Latest Patents

Steinlesberger's latest patents include a "Method for manufacturing a layer arrangement" and "Process for producing ultrathin homogenous metal layers." The "Method for manufacturing a layer arrangement" involves embedding multiple electrically conductive structures in a substrate, where material is selectively removed to create interlayers and insulating layers, facilitating the formation of air gaps between conductive structures. This technology has potential applications in various electronic devices.

The "Process for producing ultrathin homogenous metal layers" details a method for forming thin metal layers used in integrated electronic components. This technique involves depositing a first metal layer and subsequently adding a second layer through electrochemical redox processes, ensuring the creation of rigorous and uniform contact pads and wirings.

Career Highlights

Gernot Steinlesberger works at Infineon Technologies AG, a leader in semiconductor solutions. His work at Infineon showcases his role in advancing electronic technologies, contributing to the development of efficient manufacturing processes for electronic components. With his deep knowledge and hands-on experience, he continues to push the boundaries of innovation within the semiconductor industry.

Collaborations

Throughout his career, Steinlesberger has collaborated with notable coworkers, including Eugen Unger and Zvonimir Gabric. These partnerships have fostered a creative environment, leading to the successful development of innovative technologies and fostering knowledge exchange among peers.

Conclusion

Gernot Steinlesberger stands out as a dedicated inventor in the field of layer arrangements and ultrathin metal layers. His contributions, particularly through his patents, have significant implications for the electronics industry. As he continues his work at Infineon Technologies AG, his innovations promise to enhance the efficiency and capabilities of future electronic devices.