Hagen, Germany

Gerhard Mier

This inventor holds 1 USPTO granted patent. Top assignees: Fried Krupp, Hoesch-Krupp. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gerhard Mier. Retrieved from https://idiyas.com/inventor/gerhard-mier-g6anpq2z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Gerhard Mier and a Method for Producing Helical Springs.

Introduction

Gerhard Mier is an inventor associated with Hagen, Germany. His patent work includes a method for producing helical springs from steel wire, designed to make springs smaller and lighter while maintaining their strength.

Latest Patents

Mier’s listed patent, “Method for Producing Helical Springs,” describes thermomechanically hardening the surface of unstressed springs through a sequence of shot-peening and thermal-destressing steps. After the springs are destressed, they are shot-peened again in at least two stages. The first stage uses coarser shot for rough peening, while the second uses finer shot at a lower speed. This process increases compression at the wire’s surface and polishes it, helping produce springs that are as strong as conventional springs but smaller and lighter. Mier is credited with 1 patent.

Career Highlights

Mier’s career is associated with Hoesch-Krupp and Fried Krupp. His spring-manufacturing method reflects an effort to improve component performance while reducing size and weight.

Collaborations

Mier’s listed coworker is Josef Wienand.

Conclusion

Gerhard Mier’s patent describes a staged surface-treatment process for producing strong, lighter helical springs, and his work is associated with Hoesch-Krupp and Fried Krupp.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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