Gerald L Cheney

Title: Gerald L Cheney: Innovator in Semiconductor Packaging

Introduction

Gerald L Cheney is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods in molding plastic semiconductor packages. His work has had a profound impact on the efficiency and reliability of semiconductor manufacturing.

Latest Patents

Gerald L Cheney holds a patent for a method of molding plastic semiconductor packages. This patent describes a process where the plating of all surfaces of the molding tool that come into contact with molten resin is coated with a nodular thin dense chromium (NTDC) layer. This innovative approach prevents the surfaces from adhering to the package body, ensuring good package release without the formation of cracks or craters. As a result, the amount of release agents and adhesion promoters used in the molding compound can be significantly reduced or eliminated, leading to improved strength and adhesion of the package body. This advancement enhances the package's resistance to crack propagation and moisture penetration.

Career Highlights

Gerald L Cheney is associated with Amkor Technology, Inc., a leading company in semiconductor packaging. His expertise and innovative methods have contributed to the company's reputation for quality and reliability in the industry.

Collaborations

Throughout his career, Gerald has collaborated with talented individuals such as Sean Timothy Crowley and David S Razu. These collaborations have fostered an environment of innovation and have led to advancements in semiconductor technology.

Conclusion

Gerald L Cheney's contributions to the field of semiconductor packaging through his innovative patent have significantly improved manufacturing processes. His work exemplifies the importance of innovation in technology and its impact on the industry.