Company Filing History:
Years Active: 2002
Title: George Preece - Innovator in Silicon Wafer Technology
Introduction
George Preece is an accomplished inventor based in Vancouver, WA (US). He has made significant contributions to the field of silicon wafer technology, particularly through his innovative patent that addresses common issues in the slicing process.
Latest Patents
George Preece holds a patent for an "Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw." This invention involves a wire saw slicing apparatus capable of producing wafers with a flat shape while minimizing bow and warp. The apparatus features a layer of parallel wires that move in either a reciprocating or continuous manner as a cylindrical workpiece is advanced through the wires. An abrasive slurry is supplied during the slicing process. The design includes wire guides with an outer sleeve that has a higher thermal coefficient of expansion, while the substructure has a lower thermal coefficient of expansion. This innovative design helps restrict axial expansion, enhancing the slicing accuracy.
Career Highlights
George Preece is currently employed at Seh America, Inc., where he continues to develop and refine technologies related to silicon wafer production. His expertise in this area has positioned him as a valuable asset to his company and the industry.
Collaborations
George has collaborated with Oleg V Kononchuk, contributing to advancements in their field through shared knowledge and expertise.
Conclusion
George Preece is a notable inventor whose work in silicon wafer technology has led to innovative solutions for reducing bow and warp in sliced wafers. His contributions continue to impact the industry positively.