Poyntelle, PA, United States of America

George Joseph Matarese

This inventor holds 4 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1994-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: George Joseph Matarese. Retrieved from https://idiyas.com/inventor/george-joseph-matarese

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Bradenton, FL (US) (1994 - 1996)
  • Poyntelle, PA (US) (1995 - 2002)

Company Filing History:


Years Active: 1994-2002

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations of George Joseph Matarese

Introduction

George Joseph Matarese is a notable inventor based in Poyntelle, PA (US). He has made significant contributions to the field of electronic packaging and materials science. With a total of 4 patents to his name, Matarese's work has had a considerable impact on the industry.

Latest Patents

Matarese's latest patents include a method for enhancing the adhesion performance of roll sputtered strike layers. This innovation improves the adhesion of a chromium-copper layer to polyimide by controlling the reduction of water content in the polyimide, rather than eliminating it entirely. The resulting electronic packaging device, which incorporates a flexible circuit prepared by this method, exhibits greatly improved reliability. This invention is believed to have applications in enhancing adhesion between various organic materials and inorganic materials.

Another significant patent is a method for metallizing through holes in thin film substrates. This method involves vapor phase depositing a thin seed layer of materials such as chromium and copper onto the side walls of through holes in thin film substrates like polyimide. This technique is particularly useful in fabricating devices such as thin film semiconductor chip carriers, where a semiconductor chip is electrically connected to a ground plane or power conductor via metallized through holes.

Career Highlights

Matarese is currently associated with International Business Machines Corporation (IBM), where he continues to innovate and contribute to advancements in technology. His work has been instrumental in developing reliable electronic packaging solutions.

Collaborations

Matarese has collaborated with notable coworkers, including Kim Joseph Blackwell and Pei C Chen, further enhancing the innovative environment in which he works.

Conclusion

George Joseph Matarese's contributions to the field of electronic packaging and materials science are noteworthy. His innovative patents and ongoing work at IBM demonstrate his commitment to advancing technology and improving product reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…