George C Phillips, Jr

Title: The Innovations of George C Phillips, Jr.

Introduction

George C Phillips, Jr. is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of microelectronics, holding two patents that showcase his innovative spirit and technical expertise. His work primarily focuses on ceramic substrates, which are essential components in various electronic devices.

Latest Patents

Phillips' latest patents include a "Pinned Ceramic Substrate" and a "Multilayer Ceramic Substrate Structure." The pinned ceramic substrate utilizes powdered metallurgy pins formed in situ on the substrate, enhancing its structural integrity. The multilayer ceramic substrate structure features a microelectronic multilayer circuit design that incorporates circuit compatibility within the package. This design includes conductive electrical interconnection means, achieved by uniquely metallizing the 'via' and/or blind interconnection holes, ensuring efficient assembly and functionality.

Career Highlights

George C Phillips, Jr. is associated with the International Business Machines Corporation, commonly known as IBM. His role at IBM has allowed him to work on cutting-edge technologies and contribute to advancements in microelectronics. His patents reflect his commitment to innovation and improving electronic components.

Collaborations

Throughout his career, Phillips has collaborated with talented individuals such as Octavio I Chirino and Joseph Hromek. These collaborations have likely enriched his work and contributed to the successful development of his patented technologies.

Conclusion

George C Phillips, Jr. stands out as an influential inventor in the field of microelectronics. His patents demonstrate his innovative approach to solving complex engineering challenges. His contributions continue to impact the industry and inspire future advancements in technology.