Georg Parteder

Title: Georg Parteder: Innovator in Through-Substrate Via Technology

Introduction

Georg Parteder is a notable inventor based in Eindhoven, Netherlands. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to through-substrate vias.

Latest Patents

Georg Parteder holds a patent titled "Through-substrate via and method for manufacturing a through-substrate via." This invention involves an open through-substrate via (TSV) that includes an insulation layer adjacent to the side walls of a trench and the surface of a substrate body. The TSV also features a metallization layer, a redistribution layer, and a capping layer, all designed to enhance the functionality and efficiency of semiconductor devices. The insulation layer and/or the capping layer consist of distinct sublayers with varying material properties, which contribute to the overall performance of the TSV.

Career Highlights

Georg Parteder is currently employed at Ams AG, a company known for its advancements in sensor solutions and semiconductor technology. His work at Ams AG has allowed him to focus on innovative solutions that push the boundaries of current technology.

Collaborations

Throughout his career, Georg has collaborated with talented professionals such as Stefan Jessenig and Jochen Kraft. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective fields.

Conclusion

Georg Parteder's contributions to through-substrate via technology exemplify his commitment to innovation in the semiconductor industry. His patent and work at Ams AG highlight the importance of collaboration and creativity in driving technological advancements.