Brooklyn, NY, United States of America

Geoffrey G Von Allmen

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Geoffrey G Von Allmen: Innovator in Ultrasound Assisted Immersion Cooling

Introduction

Geoffrey G Von Allmen is a notable inventor based in Brooklyn, NY (US). He has made significant contributions to the field of electronic device cooling technologies. His innovative approach focuses on enhancing the efficiency of cooling systems through the use of ultrasound technology.

Latest Patents

Geoffrey holds a patent for "Ultrasound assisted immersion cooling." This patent describes apparatuses, methods, and storage media associated with cooling one or more heat-generating components of an electronic device. In his invention, an electronic device may include a tank filled with a dielectric fluid and one or more heat-generating components. Additionally, the device features transducers coupled with the tank, which are configured to generate ultrasonic waves that control the movement of the dielectric fluid within the tank. This innovative cooling method presents a promising solution for managing heat in electronic devices.

Career Highlights

Geoffrey G Von Allmen is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies. His work at Intel has positioned him as a key player in the advancement of electronic cooling solutions. With a focus on practical applications, Geoffrey's inventions aim to improve the performance and longevity of electronic devices.

Collaborations

Geoffrey has collaborated with notable colleagues, including Shankar Krishnan and Richard Christopher Stamey. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Geoffrey G Von Allmen is a pioneering inventor whose work in ultrasound assisted immersion cooling is shaping the future of electronic device technology. His contributions are vital in addressing the challenges of heat management in modern electronics.

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