Fukushima, Japan

Genzo Asai



Average Co-Inventor Count = 2.4

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Iwaki, JP (2007)
  • Fukushima, JP (2003 - 2011)

Company Filing History:


Years Active: 2003-2011

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4 patents (USPTO):Explore Patents

Title: Genzo Asai: Innovator in Thermally Foamable Microspheres

Introduction

Genzo Asai is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of polymer technology, particularly in the development of thermally foamable microspheres. With a total of 4 patents to his name, Asai's work has implications in various industrial applications.

Latest Patents

Asai's latest patents focus on the creation of thermally foamable microspheres. One of his inventions provides a thermally foamable microsphere with a structure that encapsulates a foaming agent within a polymer shell. This shell contains an organosilicon compound and is produced through a suspension polymerization process involving a polymerizable mixture. Another patent details a thermally foamable microsphere whose shell is formed from a polymer obtained by polymerizing a mixture of polymerizable and crosslinkable monomers. This invention boasts a maximum expansion ratio of at least 5, showcasing the innovative nature of Asai's work.

Career Highlights

Throughout his career, Genzo Asai has worked with prominent companies such as Kureha Corporation and Kureha Kagaku K.K. His experience in these organizations has allowed him to refine his expertise in polymer science and contribute to groundbreaking innovations.

Collaborations

Asai has collaborated with notable colleagues, including Yoshikatsu Satake and Tetsuo Ejiri. These partnerships have further enriched his research and development efforts in the field of thermally foamable microspheres.

Conclusion

Genzo Asai's contributions to the field of polymer technology, particularly through his innovative patents, highlight his role as a significant inventor. His work continues to influence advancements in materials science and industrial applications.

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