Company Filing History:
2 out of 158 
2 out of 4,811 
Years Active: 2017-2020
Title: Genta Wada: Innovator in Metal-Base Printed Circuit Boards
Introduction
Genta Wada is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of printed circuit boards, particularly focusing on enhancing their thermal conductivity and preventing electrochemical migration.
Latest Patents
Wada holds 2 patents, with his latest invention being a highly thermally conductive metal-base printed circuit board. This innovative design prevents electrochemical migration by inhibiting the elution of copper ions. The printed circuit board consists of a metal base plate, an insulating resin layer, and a copper foil layer stacked in that order. The insulating resin layer incorporates a first inorganic filler made of particles with diameters ranging from 0.1 nm to 600 nm, averaging between 1 nm to 300 nm. Additionally, it contains a second inorganic filler with particle diameters from 100 nm to 100 µm, averaging between 500 nm to 20 µm. Both fillers are uniformly dispersed within the insulating resin layer, enhancing the board's performance.
Career Highlights
Throughout his career, Genta Wada has worked with esteemed organizations such as Waseda University and Fuji Electric Co., Ltd. His experience in these institutions has allowed him to develop and refine his innovative ideas in the field of electronics.
Collaborations
Wada has collaborated with notable colleagues, including Yoshimichi Ohki and Yuichi Hirose. Their combined expertise has contributed to advancements in the technology surrounding printed circuit boards.
Conclusion
Genta Wada's work in developing metal-base printed circuit boards showcases his commitment to innovation in electronics. His patents reflect a deep understanding of materials and their applications, positioning him as a key figure in the industry.