New York, NY, United States of America

Genine E Regante

This inventor holds 1 USPTO granted patent. Top assignee: Philip Morris USA Inc.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Genine E Regante. Retrieved from https://idiyas.com/inventor/genine-e-regante

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Genine E Regante: Innovator in Multi-Pack Packaging Solutions

Introduction

Genine E Regante is a notable inventor based in New York, NY (US). She has made significant contributions to the field of packaging technology. Her innovative approach has led to the development of a unique packaging solution that addresses the needs of product distribution.

Latest Patents

Genine holds a patent for a Multi-pack packaging sleeve. This invention comprises first and second pack receiving pockets, each having at least one open end for the insertion of product packs. A vertical hinge line is positioned between the pockets, and a vertical slotted opening extends from one end of the hinge line. Each pack receiving pocket is designed to accommodate a single product pack, while multiple packs can also be received within at least one of the pockets. Closure flaps may be provided to close one end of each pocket. Genine has 1 patent to her name.

Career Highlights

Genine is currently employed at Philip Morris USA Inc., where she continues to innovate in packaging solutions. Her work has been instrumental in enhancing the efficiency and functionality of product packaging.

Collaborations

Genine has collaborated with talented individuals such as Antonio Giusto and Pamela D Moore, who have contributed to her projects and innovations.

Conclusion

Genine E Regante is a pioneering inventor whose work in multi-pack packaging solutions showcases her commitment to innovation. Her contributions are shaping the future of packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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