This inventor holds 3 USPTO granted patents. Top assignee: Hon Hai Precision Industry Co., Ltd.. Active years: 2003-2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003-2004
Title: Gencai Wang: Heat-Sink Attachment and Cooling Innovations
Introduction
Gencai Wang is an inventor based in Shenzhen, China, whose patent work includes mechanical components for securing heat sinks to electronic devices. His listed patents are associated with Hon Hai Precision Industry Co., Ltd. Wang’s portfolio includes 3 patents.
Latest Patents
**Clip for Heat Sink.** This invention describes a clip that secures a heat sink to an electronic chip mounted on a socket. Its substantially V-shaped body has two legs that engage projections on the socket, while an integrated handle allows the clip to be operated by hand. Pressing the handle flexes the second leg to engage or release its socket projection.
**Heat Sink Assembly with Spring Clamp.** This assembly combines a heat sink, a flexible-wire clip, and a spring clamp. The heat sink has pin fins and crossing rows of slots. The clip’s hooks engage the assembly, while a raised portion on its central body fits into an opening in the clamp. Deformable wings on the clamp retain it in the heat sink’s slots, helping secure the clip and heat sink together.
Career Highlights
Wang’s listed inventions address practical challenges in electronic cooling, particularly the attachment of heat sinks to chips and the retention of clips within heat-sink assemblies. The designs use resilient metal components and formed features to support secure, manually operable connections.
Collaborations
Wang’s listed company affiliation is Hon Hai Precision Industry Co., Ltd. His named coworkers include Hsieh Kun Lee and Tao Li.
Conclusion
Gencai Wang’s patent work focuses on mechanical fastening solutions for heat-sink assemblies, combining clips, spring clamps, and resilient engagement features to support electronic cooling systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
