Geert Steenbruggen

Title: Geert Steenbruggen and Air-Cavity Packaging for Flip-Chip Devices.

Introduction

Geert Steenbruggen is an inventor associated with Wamel, the Netherlands, and NXP B.V. His listed patent concerns semiconductor packaging, specifically an air-cavity package for flip-chip devices. The supplied information identifies 1 patent associated with him.

Latest Patents

Steenbruggen’s listed invention, “Air Cavity Package for Flip-Chip,” describes a method for manufacturing a semiconductor device in an air-cavity package. The process begins with a lead frame that has predetermined pad landings on its top-side surface. Laminate material is applied to that surface, and regions are defined within the laminate for the air cavity and electrical contacts.

The device die is mounted with its active surface facing the laminate. Ball bonds connect the die’s bond pads to the lead-frame pad landings, while an air cavity is formed between the die’s active surface and the lead frame’s top-side surface. This arrangement combines electrical connections with a cavity in the package structure.

Career Highlights

The information provided associates Steenbruggen with NXP B.V., a company active in semiconductor technology. His listed patent reflects work on packaging methods for flip-chip devices, where the arrangement of the die, lead frame, laminate, and air cavity is central to the design.

Collaborations

Paul Dijkstra is identified as Steenbruggen’s coworker. The supplied information does not specify the nature of their collaboration or whether Dijkstra contributed to the listed patent.

Conclusion

Geert Steenbruggen’s listed patent focuses on an air-cavity packaging method that connects a flip-chip die to a lead frame while preserving a cavity beneath the active surface.